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2024第二屆熱管理材料技術(shù)
博覽會(huì)---導(dǎo)熱散熱材料、雙面膠、膠粘劑展將于2024/11/6至2024/11/8在深圳.深圳國(guó)際
會(huì)展中心舉辦,期待您的光臨。
2024第二屆熱管理材料技術(shù)
博覽會(huì)---導(dǎo)熱散熱材料、雙面膠、膠粘劑展歡迎以下企業(yè)
參展：
1. 材料主題展示區(qū)
原材料：導(dǎo)熱填料、聚合物基底材料、封裝材料等
導(dǎo)/散熱材料：熱界面材料、導(dǎo)熱高分子材料、碳材料、陶瓷基板、熱沉材料、相變材料（儲(chǔ)熱）等
隔熱材料：氣凝膠、泡沫隔熱材料、真空板、碳?xì)�、�?fù)合保溫隔熱材料等
輔助材料與配件：離型膜、雙面膠、膠粘劑、密封劑等
1. Materials
Raw Materials: thermally conductive fillers, polymer materials, package materials, etc.
Thermal Conduction\Dissipation Materials: thermal interface materi- als, thermal conductive polymer materials, carbon materials, ceramic substrate, heat sink, phase change materials (heat storage), etc.
Thermal insulation materials: aerogel materials, foam insulation materi- al, vacuum plate, carbon felt, composite thermal insulation materials, etc.
Auxiliary materials: release transfer tape, adhesive,sealant,double sided tape, etc.
2. 液冷主題展示區(qū)
原材料：冷卻液，金屬材料等
零部件：快接頭，管路，膨脹閥，節(jié)流閥，電磁閥，泵，冷板，壓縮機(jī)，蒸發(fā)器，機(jī)箱冷量分配單元、不間斷電源等
液冷技術(shù)：冷板式液冷，浸沒(méi)式液冷，噴淋式液冷，智能溫控技術(shù)，模擬仿真與設(shè)計(jì)，數(shù)據(jù)中心解決方案等
1. Liquid Cooling
Raw Materials: coolant, metal materials, etc.
Components: quick coupling, pipeline, expansion valve, throttle valve, solenoid valve, pump, cooling plate, compressor, evaporator, tank, Coolant distribution unit, uninterruptible power supply, etc.
Liquid Cooling Technology: cold plate liquid cooling, immersion liquid cooling, spray liquid cooling, intelligent temperature control technology, simulation and design, data center solutions, etc.
3. 儀器/設(shè)備展示區(qū)
分析測(cè)試儀器：熱物性測(cè)量設(shè)備，氣體檢測(cè)和分析，黏度計(jì)，拉力機(jī)，密度計(jì)，硬度儀，X射線衍射儀，漏液檢測(cè)等
自動(dòng)化設(shè)備：點(diǎn)膠機(jī)，涂布/覆膜/壓延/收卷，碳化/石墨化，模切；研磨，分散，均質(zhì)，脫泡，灌裝，封裝，焊接，壓鑄，真空注液等
1. Instruments/Equipment
Analysis and testing instruments: thermophysical properties measure- ment equipments, gas detection and analysis, viscometer, tension machine, densitometer, sclerometer, X-ray diffractometer, leakage detection, etc.
Automatic equipment: dispensing machine, coating/laminating/calen- dering/winding, carbonization/graphitization, die cutting; grinding, dispersion, homogenization, defoaming, filling, encapsulation, welding, die casting, vacuum injection, etc.
