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1、精密成型：精密切削與成型機(jī)床、激光/等離子切割機(jī)、沖壓/折彎設(shè)備、轉(zhuǎn)塔沖床、精密沖床及折彎機(jī)、電火花線切割機(jī)、旋壓機(jī)‌、焊接/搬運(yùn)機(jī)器人‌、協(xié)作機(jī)器人、智能檢測儀器、精密模具與工具、液壓破碎錘、精密傳動設(shè)備、陶瓷基板制造設(shè)備等精密陶瓷成型設(shè)備、3D打印與增材制造、金屬粉末成型及精密結(jié)構(gòu)快速制造技術(shù)設(shè)備等；‌‌
2、激光精密加工設(shè)備：飛秒/皮秒激光器‌、水導(dǎo)激光設(shè)備、切割與表面處理設(shè)備、五軸聯(lián)動機(jī)床、曲面加工‌設(shè)備、復(fù)合加工設(shè)備（激光切割與車削）、激光增材設(shè)備、3D打印、智能與綠色化設(shè)備等行業(yè)專用設(shè)備；
3、人形機(jī)器人精密加工：高精度磨削設(shè)備（螺紋磨床、雙端面磨床）、五軸聯(lián)動加工設(shè)備、
精密電子組裝加工設(shè)備
Precision electronic assembly and processing equipment
錫膏印刷機(jī)、SMT貼片機(jī)、‌回流焊爐等SMT貼裝與焊接設(shè)備、浮動擰緊系統(tǒng)、‌自動旋擰組裝機(jī)、檢測與測試設(shè)備、3D在線AOI檢測儀、‌ICT測試儀、‌金屬板沖壓成型設(shè)備等；
Solder paste printing machines, SMT surface mount machines, reflow soldering furnaces and other SMT mounting and welding equipment, floating tightening systems, automatic screw assembly machines, detection and testing equipment, 3D online AOI detectors, ICT testers, metal plate stamping and forming equipment, etc;
半導(dǎo)體精密加工設(shè)備
Semiconductor precision machining equipment
8.1、前道制造設(shè)備：光刻機(jī)、極紫外光刻機(jī)、深紫外光刻機(jī)（DUV）、刻蝕設(shè)備、等離子體刻蝕機(jī)‌、干法/濕法刻蝕設(shè)備、‌薄膜沉積設(shè)備、化學(xué)氣相沉積技術(shù)設(shè)備、物理氣相沉積設(shè)備、離子注入機(jī)、‌清洗設(shè)備等；
8.2、封裝與測試設(shè)備：切割設(shè)備、高精度劃片機(jī)、全自動切割分選一體機(jī)‌、封裝設(shè)備（切割機(jī)、研磨機(jī)、焊接機(jī)、粘貼機(jī)）、測試設(shè)備、探針臺與測試機(jī)等；
8.3、輔助與檢測設(shè)備：量測設(shè)備、電子顯微鏡、X射線探測儀、晶圓搬運(yùn)機(jī)械手、單晶爐與分子束外延系統(tǒng)（MBE）等；
8.1. Pre manufacturing equipment: lithography machine, extreme ultraviolet lithography machine, deep ultraviolet lithography machine (DUV), etching equipment, plasma etching machine, dry/wet etching equipment, thin film deposition equipment, chemical vapor deposition technology equipment, physical vapor deposition equipment, ion implantation machine, cleaning equipment, etc;
8.2 Packaging and testing equipment: cutting equipment, high-precision cutting machines, fully automatic cutting and sorting machines, packaging equipment (cutting machines, grinding machines, welding machines, pasting machines), testing equipment, probe stations and testing machines, etc;
8.3. Auxiliary and testing equipment: measuring equipment, electron microscopes, X-ray detectors, wafer handling manipulators, single crystal furnaces, and molecular beam epitaxy (MBE) systems, etc;