● 電子元器件：機電元件、無源元件及半導體產(chǎn)品、二極管、晶體、石英、存儲器、處理器、集成電路、光電與顯示器件、插座、電源、連接器、開關(guān)、繼電器、線纜、濾波器、電感、電位器、散熱器、電阻、電容器、電聲器件、激光器件、電子顯示器件、傳感器、微特電機、變壓器、微波元件、壓電元件、陶瓷磁性材料、印制電路板、印制電路板用基材基板、電子功能工藝專用材料、電子膠帶制品、電子化學材料及部品
● 半導體分立器件產(chǎn)品與應用技術(shù)、IC產(chǎn)品與應用技術(shù)、IC測試方法與測試儀器、IC設計與設計工具、IC制造與封裝、半導體光電器件
● 半導體設計、封測、制造產(chǎn)廠商；半導體生產(chǎn)設備：全套生產(chǎn)線、光刻機、刻蝕機、薄膜設備、擴散\離子注入設備、濕法設備、過程檢測設備

● Electronic components: electromechanical components, passive components and semiconductor products, diodes, crystals, quartz, memory, processors, integrated circuits, optoelectronic and display devices, sockets, power supplies, connectors, switches, relays, cables, filters, inductors, potentiometers, radiators, resistors, capacitors, electroacoustic devices, laser devices, electronic display devices, sensors, micro-motors, transformers, microwave components, piezoelectric components, ceramic magnetic materials, printed circuit boards, printed circuit board substrates, Electronic functional process special materials, electronic tape products, electronic chemical materials and parts
● Semiconductor discrete device products and application technology, IC products and application technology, IC test methods and test instruments, IC design and design tools, IC manufacturing and packaging, semiconductor optoelectronic devices
● Semiconductor design, packaging and testing, manufacturing manufacturers; Semiconductor production equipment: complete production line, lithography machine, etching machine, thin film equipment, diffusionion implantation equipment, wet equipment, process testing equipment

會展服務

外博會展
主營業(yè)務：展會招商、展位預定

參觀須知

參加半導體展會您可以發(fā)現(xiàn)世界范圍內(nèi)半導體的創(chuàng)新和發(fā)展趨勢
前往德國參加2026埃森半導體展會請報名后根據(jù)展會時間提前辦理簽證

參展須知

展會一年一屆，展會規(guī)模每屆都在增加，是中國企業(yè)開拓德國市場的貿(mào)易平臺
1、參加2026埃森半導體展會請?zhí)峤恍枨�，平臺安排代理商對接，定制參展方案
2、確定展位簽約付款后，進行展臺及宣傳海報設計
3、選擇展品并告知展品的中英文名稱、體積、重量、規(guī)格、貨品價值，準備報關(guān)資料
4、在貨運截止日期之前將貨品打包，安排運輸至貨運集中港口/集貨倉庫
5、確定參展人員名單安排簽證、酒店、機票等事宜